Metal Mask Smaller Than Land Pattern 3 3 Metal mask design A metal mask is a lithograph for printing a solder paste on the land pattern of a printed wiring board Recommended thickness of the metal mask is from 125 to 175 m However the adjustment of the thickness may be also required due to the balance of peripheral parts size Figure 3 7 Recommended
Two types of land patterns are used for surface mount packages Solder Mask Defined SMD Solder mask openings smaller than metal pads Non Solder Mask Defined NSMD Solder mask openings larger than metal pads Two types of solder mask land patterns are used for SMT devices Solder Mask Defined SMD where the solder mask openings are smaller than the metal pads and Non Solder Mask Defined NSMD where the
Metal Mask Smaller Than Land Pattern
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3 2 Land Pattern Design ref IPC SM 7351A or 782 There are two types of land patterns are chosen for user PCB design one is Solder Mask Defined SMD solder mask openings smaller than metal pads The other is Non Solder Mask Defined NSMD solder mask openings larger than metal pads Better control of the The Mask category of design rules Solder Mask Expansion Default Rule required At least one rule of this type must exist Disable the rule if not required The shape that is created on the solder mask layer at each pad and via site is the pad or via shape or hole expanded or contracted radially by the amount
5 2 NSMD vs SMD LAND PATTERN Two types of land patterns are used for surface mount packages 1 Non SolderMask Defined pads NSMD and 2 Solder Mask Defined pads SMD NSMD pads have a solder mask opening that is larger than the pad whereas SMD pads have a solder mask opening that is smaller Non solder mask defined NSMD The metal pad is smaller than the solder mask opening Solder mask defined SMD The solder mask opening is smaller than the metal pad Figure 8 NSMD and SMD land patterns You must choose between NSMD and SMD for your PCB depending on the overall product reliability
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Non solder mask defined NSMD The metal pad on the PCB to which the package ball is attached is smaller than the solder mask opening Solder mask defined SMD The solder mask opening is smaller than the metal pad Typically NSMD land pads are more reliable for board level mechanical performance however even after a long storage time The land pattern design and SMT mounting of FBGA type packages are based on the IPC 7351 and IPC 7095 standards A Non Sol der Mask Defined NSMD pad design is recom mended for all board pads as shown in Figure 5 where b is the solder ball diameter b1 is the
1 SMD Solder mask openings are smaller than metal pads 2 NSMD Solder mask openings larger than metal pads NSMD is recommended for the perimeter I O land pad which allows the solder to wrap around the sides of the metal pads on the board for a reliable solder joint PCB pad see Figure 1 The solder mask opening is slightly smaller than the pad size which creates an overlay area between the solder mask layer and the pad layer SMD pad design offers several benefits First the overlapping solder mask helps prevent th e pads from lifting off of the PCB surface due to thermal or
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3 3 Metal mask design A metal mask is a lithograph for printing a solder paste on the land pattern of a printed wiring board Recommended thickness of the metal mask is from 125 to 175 m However the adjustment of the thickness may be also required due to the balance of peripheral parts size Figure 3 7 Recommended
https://www.renesas.com/us/en/document/oth/tb389...
Two types of land patterns are used for surface mount packages Solder Mask Defined SMD Solder mask openings smaller than metal pads Non Solder Mask Defined NSMD Solder mask openings larger than metal pads
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Metal Mask Smaller Than Land Pattern - Two types of land patterns are used for surface mount devices Solder Mask Defined SMD pads have solder mask openings that are smaller than metal pads Non Solder Mask Defined NSMD pads have solder mask opening that are larger than the metal pads
