Titanium Oxynitride Hard Mask For Lithographic Patterning

Titanium Oxynitride Hard Mask For Lithographic Patterning Titanium oxynitride provides etch resistance during transfer of a combined first and second pattern but can be readily removed by a wet etch without causing surface damages to copper surfaces

The titanium nitride layer may be partially or fully converted into a titanium oxynitride layer which is subsequently patterned with a first pattern Alternately the titanium nitride layer with or without a titanium oxynitride layer thereupon may be patterned with a line pattern and physically exposed surface portions of the The tunable titanium oxynitride is configured to function as a hard mask and as an antireflective coating Also disclosed are methods for patterning the lithographic multilayer

Titanium Oxynitride Hard Mask For Lithographic Patterning

micromachines-free-full-text-a-magnetic-metal-hard-mask-on-silicon

Titanium Oxynitride Hard Mask For Lithographic Patterning
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We use frameless single crystal silicon membranes with nanoscale patterns as contact hard masks enabling plasma etching metal lift off and ion implantation on various unconventional A novel hardmask to substrate pattern transfer method for creating 3D multi level hierarchical high aspect ratio structures for applications in microfluidics and cooling technologies

The hard mask patterning scheme preserves minimizing damage caused by the plasma and strip processes and reducing the thickness requirement for the underlying barrier film and enables superior CD and profile control The comparison of feasible hard mask lithography planarization scheme for dense pattern was Complete Patent Searching Database and Patent Data Analytics Services

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Here we compare the use of directed self assembly and conventional patterning methods in the fabrication of 7 nanometre node FinFETs using an industrially relevant and high volume ResearchGate

US20150162239A1 US14 621 785 US201514621785A US2015162239A1 US 20150162239 A1 US20150162239 A1 US 20150162239A1 US 201514621785 A US201514621785 A US 201514621785A US 2015162239 A Alternately the titanium nitride layer with or without a titanium oxynitride layer thereupon may be patterned with a line pattern and physically exposed surface portions of the titanium nitride layer may be converted into titanium oxynitride Titanium oxynitride provides etch resistance during transfer of a combined first

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Titanium Oxynitride Hard Mask For Lithographic Patterning

https://pubchem.ncbi.nlm.nih.gov/patent/US-8987133-B2
Titanium oxynitride provides etch resistance during transfer of a combined first and second pattern but can be readily removed by a wet etch without causing surface damages to copper surfaces

Sublithographic Patterning Technology Photoresist Ashing hard Mask
Titanium Oxynitride Hard Mask For Lithographic Patterning

https://www.freepatentsonline.com/8987133.html
The titanium nitride layer may be partially or fully converted into a titanium oxynitride layer which is subsequently patterned with a first pattern Alternately the titanium nitride layer with or without a titanium oxynitride layer thereupon may be patterned with a line pattern and physically exposed surface portions of the


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Titanium Oxynitride Hard Mask For Lithographic Patterning - We use frameless single crystal silicon membranes with nanoscale patterns as contact hard masks enabling plasma etching metal lift off and ion implantation on various unconventional